AMD Bump and Test Facility

Project Description

AMD will build a new clean room facility for Bump and Test requirements which will support both Fab 30 and Fab 36.

Project type: Semiconductor plant
Location: Germany (Dresden)
Area: 20,000 m²
Investor: AMD Saxony LLC & Co.KG
Time period: 01.06.2006 – 21.05.2009
Performance: Schedule control

Overall project control for the planning, procurement, construction and startup of the production building as well as for the chemical supply of the production equipment.

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